課程內容 (將依實際情況而有所更動):
1. Introduction
1.1 Introduction to surface mount technology
1.2 Introduction to through hole technology
1.3 Introduction of system assembly
1.4 Types of electronics components
1.5 Technology trend
2. SMT Process
2.1 Stencil printing
2.2 Component placement
2.3 Reflow soldering
2.4 Assembly equipment
2.5 Quality and reliability
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