電子製程 網路課程- IC封裝製程介紹
《課程大綱》
1.Introduction - Trends in IC Packag
2.Chip Scale and 3D Packaging
3.High Performance Packaging
4.System in a Package
5.Specialty Packaging
6.Package Application Engineering
電子製程 網路課程- IC封裝製程介紹
《課程大綱》
1.Introduction - Trends in IC Packag
2.Chip Scale and 3D Packaging
3.High Performance Packaging
4.System in a Package
5.Specialty Packaging
6.Package Application Engineering